Compact sputtering system for surface metallization
A compact vacuum sputtering system for surface metalization consisting of three chambers enables the application of layers by thermal and ion sputtering. The device is equipped with a container for transferring samples in controlled atmosphere conditions between the sputtering machine and the glove box or for storing them in controlled atmosphere conditions.
The most significant device features:
- Intended for layer deposition with the PVD physical vapor deposition technique
- Sample loading chamber used for insertion and removal of samples to the deposition chamber in a protective gas shield
- A sample loaded into a container, e.g., in a glove box in a protective gas atmosphere, can be transferred to the sputtering chamber under strictly controlled conditions
- Thermal deposition chamber with 1-3 thermal evaporators
- Sputter deposition chamber equipped with a magnetron
- Chambers made in HV standard
- Analysis of the thickness of the applied layers with a resolution of sub nm using a quartz balance
- Sample holder adapted to substrates with maximum dimensions of 50×50. For smaller substrates, masks cut from steel sheets with a thickness of 0.1 mm to 0.5 mm can be used. Masks provide stabilization of the position of smaller substrates during transfer and rotation. The arrangement of holes in the mask can be adapted to the substrates.
Specification:
| Loading chamber | |
| Pumping down the chamber | with a dry pump, below 0.1 mbar in 5 minutes |
| Vacuum measurement |
using a Pirani head integrated with a membrane head in the range from 1∙10ˉ³ mbar to atmospheric pressure |
| Thermal deposition chamber |
|
| Thermal transfer source |
basket-shaped crucibles with thermal shields and shutters, with the possibility of measuring and stabilizing the temperature of the filament boat-shaped tungsten crucible with a shutter |
| Tungsten crucible supply | up to 200 A |
| Ensuring the uniformity of layers |
use of a rotary table |
| Temperature of samples during deposition | stabilized in the range from room temperature to 400°C |
| Pump system |
turbomolecular with a pumping rate not less than 60l/s |
| Vacuum measurement |
using an ionization head with a hot cathode. |
| Sputtering chamber | |
| Sputtering source | magnetron 2″ It is possible to replace it with a 1″ magnetron |
| Magnetron power supply |
DC 600W |
| Gas dosing valve | manual |
| Ensuring the uniformity of layers |
use of a rotary table |
| Temperature of samples during deposition | stabilized in the range from room temperature to 400°C |
| Vacuum measurement |
using a Pirani head integrated with a membrane head in the range from 1∙10ˉ³ mbar to atmospheric pressure |
See also other thin-layer deposition systems:
Compact sputtering system LPNW01 for thermal deposition of thin layers
PVDS 700 Coating deposition system for layer deposition with the PVD technique
Magnetron system for coating deposition MCS 787 equipped with up to four magnetron sources.
