Thin-layer deposition system with thermal evaporators and magnetrons
The configuration of three vacuum chambers integrated into a single vacuum system is designed for the deposition of thin films of metallic, ceramic, and organic materials using thermal evaporators and magnetron sources. The system is equipped with a load-lock chamber and two rectangular deposition chambers, together with linear-rotary transfer mechanisms designed to transfer sample carriers between the chambers.
The system has been manufactured to UHV (Ultra-High Vacuum) standards. Due to the system configuration, the thermal deposition chamber allows for the installation of up to four thermal evaporators. Similarly, the magnetron deposition chamber can accommodate up to four magnetron sources.
The uniformity of the deposited films is ensured by the use of rotary tables, providing continuous rotation of the sample carrier during evaporation. In addition, the table is equipped with sample heating and temperature stabilization capabilities in the range of room temperature to 400°C. The sample heating and rotation station is additionally equipped with a sample shutter.
The sample carrier with the samples is transferred from the load-lock chamber to the thermal deposition chamber or to the magnetron chamber using a linear transfer mechanism, ensuring that the vacuum level in the deposition chamber does not undergo significant changes during sample transfer. Once the sample carrier has been mounted in the load-lock chamber holder, the load-lock chamber can be evacuated to the required vacuum level, after which the isolation valve separating the load-lock chamber from the deposition chamber can be opened.
The deposition chambers are designed to accommodate a sample carrier capable of holding samples with a maximum size of 50 × 50 mm. At the same time, the use of an appropriate mask allows a larger number of smaller samples to be mounted.
The operation of the system, including pressure level control, operation of the pumping system, shutter control, and thin-film deposition processes, is fully automated and controlled via dedicated software.
The most significant device features:
- Thermal and magnetron deposition chambers manufactured to UHV standards
- Allows the installation of up to four thermal evaporators and up to four magnetron sources
- Load-lock chamber for introducing samples at atmospheric pressure or using a transfer container
- Linear transfer mechanism for transporting samples from the load-lock chamber to the deposition chambers
- Layer thickness control using quartz crystal microbalances (QCMs)
- Ability to heat samples up to 400°C
- Sample mounting station enabling continuous sample rotation during the deposition process
- A pressure of below 10⁻⁶ mbar in the thermal deposition chamber is achieved within 2 hours after venting the chamber with dry air or nitrogen, using a turbomolecular pump with a pumping speed of at least 200 l/s. The base pressure after baking the chamber at 120°C for 48 hours is <10⁻⁹ mbar
- The load-lock chamber can be evacuated using a dry pump to a pressure below 5 × 10⁻² mbar, or by means of a pumping station equipped with a turbomolecular pump.
Specification:
| Source of applied material |
Up to four thermal evaporators Up to four magnetron sources |
| Working temperature of evaporators | up to 1600ºC |
| Crucible volume | 5 cm3 |
| Layer thickness control | quartz scale |
| Sample temperature | from room temperature to 400°C |
| Time to obtain vacuum |
10ˉ⁶ mbar within 2 hours of chamber aeration |
| Pump system |
turbomolecular with pumping speed >200 l/s dry fore pump with a pumping speed of not less than 5 m³/h |
See also other thin-layer deposition systems:
Compact PVD system LPNW01 for thermal deposition of thin layers
PVDS 700 Coating deposition system for layer deposition with the PVD technique
Magnetron system for coating deposition MCS 787 equipped with up to four magnetron sources.
Compact PVD and sputtering system for surface metallization with the possibility of thermal and magnetron deposition of layers
PVD system dedicated to TERS Tip Coating designed to accommodate up to four thermal evaporators
